Microelectronics Lab I

1. Sputtering System: Metal Deposition

Multi-target RF sputtering system (Alcatel) for Metal deposition

2. Sputtering System: Oxide Deposition

1. RF sputtering system for oxide and dielectric deposition
2. With reactive sputtering compatibility

3. Thermal Evaporation

Thermal evaporation system (varian 3117) for metallization for Al depostion

4. ABM Mask Aligner

1. ABM mask aligner for multilayer lithography
2. Wavelength 365 nm and 405 nm
3. Ziesss Microscope and Suess Microtech Spin coater

5. Reactive Ion Etching

1. Reactive Ion Etching System for Si and SiO2 etching
2. Equipped with SF6 and CHF3 gases

6. Diffusion Furnace

1. Diffusion furnaces (Thermoco product cooperation)
2. Used for Solid sate diffusion process

7. Oxidation and Metal Annealing

1. Oxidation furnaces (Thermoco product cooperation)
2. Used Silicon oxidation